ChipMOS TECHNOLOGIES INC.

IMOSTWD - Financial Snapshot

Technology sector | Semiconductors industry

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Metrics for IMOSTWD

Financials reported in TWD
Price $38.23
Shares Outstanding 34.77M
All-Time Low $0.79
52-Week Low $12.78

Balance Statement Metrics

Net Cash / Share $0
cashValuePerShare = (Cash + Short Term Investments - Total Liabilities) / Shares Outstanding
⇒ cashValuePerShare = ((14,978,016,000 - 21,344,058,000) / 34,770,906) = -183.0853
Net Current Assets / Share $109.38
netCurrentAssetsPerShare = (Current Assets - Total Liabilities) / Shares Outstanding
⇒ netCurrentAssetsPerShare = ((25,147,331,000 - 21,344,058,000) / 34,770,906) = 109.3809
Net Tangible Assets / Share $690.47
netTangibleAssetsPerShare = (Total Assets - Intangibles - Total Liabilities) / Shares Outstanding
Shares Outstanding Ave Change (Annual) 0.0%
Shares Δ YoY 0.0%
Avg CA Burn (Annual %) 19.15% (as of 3-8-2026)
Avg CA Burn (Quarterly %) 0.18% (as of 3-8-2026)

Earning Metrics

Max Earning Power / Share $141.73
maxEarningPowerPerShare = (EBITDA / EP_MULTIPLIER) / Shares Outstanding
⇒ maxEarningPowerPerShare = ((517,460,000 / 0.105) / 34,770,906) = 141.7332
Adjusted Earning Power $185.16
adjustedEarningPower = (Net Income / EP_MULTIPLIER) / Shares Outstanding
⇒ adjustedEarningPower = ((676,017,000 / 0.105) / 34,770,906) = 185.1622
Non-Cash Charges to Market Cap 0.0%
nonCashChargeToMKTCAP = Non-Cash Charges / Market Capitalization
Avg EBITDA (5Y) 8.5B (as of 3-8-2026)
Avg EBITDA (5Q) 604.7M (as of 3-8-2026)
Avg Net Income (5Y) 2.9B (as of 3-8-2026)
Avg Net Income (5Q) 504.3M (as of 3-8-2026)
Data as of: Price 03-20-26 16:00 ET, Balance Sheet 2025-12-31, Income Statement 2025-12-31, Cash Flow 2025-12-31

Indicators

Dividend indicators Value Date
Current Dividend Streak Yes 3-8-2026
Consecutive Years Paid 8 years 3-8-2026
Pays Dividend No 3-8-2026
Last Dividend Date 7-24-25
Income indicators Value Date
EBITDA Positive Yes 3-8-2026
Net Income Positive Yes 3-8-2026
Current Dividend Streak Yes 3-8-2026

Metric History Explorer

Pick a metric to view its history table and chart.

Tangible Book Value Per Share History

Formula: Tangible Book Value / shares from balance statements. Includes 4 quarterly + 4 annual.

Chart plots one TBV / Share point per report date (duplicate same-date annual/quarterly rows are merged).

Report Date Period TBV / Share Tangible Book Value Shares Used
2025-12-31 Quarterly $34.52 24B ($24,008,363,000) 695.4M (695,418,126)
2025-09-30 Quarterly $33.51 23.4B ($23,371,200,000) 697.4M (697,353,126)
2025-06-30 Quarterly $32.84 23.3B ($23,256,000,000) 708.1M (708,135,126)
2024-12-31 Quarterly $34.38 25B ($25,003,318,000) 727.2M (727,240,126)
2024-12-31 Annual $34.38 25B ($25,003,318,000) 727.2M (727,240,126)
2023-12-31 Annual $34.05 24.8B ($24,763,197,000) 727.2M (727,240,126)
2022-12-31 Annual $33.88 24.6B ($24,639,260,000) 727.2M (727,240,126)
2021-12-31 Annual $33.20 24.1B ($24,142,215,000) 727.2M (727,240,126)

Dividend Payments

Historical cash dividends per share from Yahoo ex-dividend dates.

Date Dividend / Share
2025-06-27 $0.822
2024-06-27 $1.112
2023-06-29 $1.501
2022-06-29 $2.919
2021-08-06 $1.568
Show 9 older dividend payments
Date Dividend / Share
2020-07-01 $1.209
2019-08-07 $0.773
2018-11-02 $0.969
2018-10-18 $0.2285
2016-10-31 $4.3698
2015-10-14 $0.1543
2014-10-14 $0.1543
2013-10-11 $0.1543
2012-12-03 $0.1543

Shares Outstanding Changes

Date Shares Outstanding Delta
2025-11-04 34,770,906 -96,750
2025-10-14 34,867,656 -539,100
2025-09-17 35,406,756 -44

Short Interest Changes

Latest short-interest change: 15,563 shares (0.05% of float) | Days to cover: 0.37

Date Short Interest Delta Δ %
2026-03-12 15,563 shares -3,893 -20.01%
2026-02-27 19,456 shares +3,362 +20.89%
2026-02-11 16,094 shares -73,787 -82.09%

Interesting Volume Days

Volume/ratio use shares outstanding as of the event date (frozen).

Date Volume Shares Outstanding Volume / Shares Price
No interesting volume events

ChipMOS TECHNOLOGIES INC. engages in the research and development, manufacture, and sale of integrated circuits, and related assembly and testing services in Taiwan, Japan, the People's Republic of China, Singapore, and internationally. The company operates through five segments: Testing, Assembly, Display Panel Driver Semiconductor Assembly and Testing (LCDD), Bumping, and Others. It offers a range of back-end testing services for high density memory, mixed-signal, and display driver semiconductors; and packaging solutions, such as small outline package, thin small outline package, quad flat package, and substrate-based packages. The company also provides testing solutions for the entire spectrum of integrated circuits, including simple digital logic, complex ASIC, high speed digital, memory, and mixed signal and display driver IC (DDIC) devices. In addition, it offers bumping services, including gold bumping, metal composite bumping, ball drop, copper re-distribution layer, and copper pillar technology. Further, the company provides wafer-level chip scale packaging technology for IC chips in the form of wafer; and turnkey solutions, including wafer bumping/RDL, wafer sort, assembly, final test, and drop shipment. Its semiconductors are used in personal computers, communications equipment, office automation, and consumer electronics. The company was incorporated in 1997 and is headquartered in Hsinchu City, Taiwan.