Data as of:
Price 02-03-26 16:00 ET,
Balance Sheet 2025-09-30,
Income Statement 2025-09-30,
Cash Flow 2025-09-30
Indicators
Dividend indicators
Value
Date
Pays Dividend
No
2-1-2026
Last Dividend Date
7-24-25
Income indicators
Value
Date
EBITDA Positive
Yes
2-1-2026
Net Income Positive
Yes
2-1-2026
Avg CA Burn (Annual %)
19.15%
2-1-2026
Avg CA Burn (Quarterly %)
-2.76%
2-1-2026
Shares Outstanding Changes
Date
Shares Outstanding
Delta
2025-11-04
34,770,906
-96,750
2025-10-14
34,867,656
-539,100
2025-09-17
35,406,756
-44
Short Interest Changes
Latest short interest:
89,881 shares
(0.29% of float)
| Days to cover: 3.86
Date
Short Interest
Delta
Δ %
2026-02-03
89,881 shares
+0
+0.00%
2026-02-02
89,881 shares
+0
+0.00%
2026-01-30
89,881 shares
None
—
Interesting Volume Days
Volume/ratio use shares outstanding as of the event date (frozen).
Date
Volume
Shares Outstanding
Volume / Shares
Price
No interesting volume events
ChipMOS TECHNOLOGIES INC. engages in the research and development, manufacture, and sale of integrated circuits, and related assembly and testing services in Taiwan, Japan, the People's Republic of China, Singapore, and internationally. The company operates through five segments: Testing, Assembly, Display Panel Driver Semiconductor Assembly and Testing (LCDD), Bumping, and Others. It offers a range of back-end testing services for high density memory, mixed-signal, and display driver semiconductors; and packaging solutions, such as small outline package, thin small outline package, quad flat package, and substrate-based packages. The company also provides testing solutions for the entire spectrum of integrated circuits, including simple digital logic, complex ASIC, high speed digital, memory, and mixed signal and display driver IC (DDIC) devices. In addition, it offers bumping services, including gold bumping, metal composite bumping, ball drop, copper re-distribution layer, and copper pillar technology. Further, the company provides wafer-level chip scale packaging technology for IC chips in the form of wafer; and turnkey solutions, including wafer bumping/RDL, wafer sort, assembly, final test, and drop shipment. Its semiconductors are used in personal computers, communications equipment, office automation, and consumer electronics. The company was incorporated in 1997 and is headquartered in Hsinchu City, Taiwan.