Technology sector | Semiconductors industry
| Price | $28.19 |
|---|---|
| Shares Outstanding | 34.77M |
| Net Current Assets / Share | $100.45 |
| Net Tangible Assets / Share | $672.15 |
| Max Earning Power / Share | $89.92 |
| Adjusted Earning Power |
$242.49
adjustedEarningPower = (Net Income / EP_MULTIPLIER) / Shares Outstanding
|
| Non-Cash Charges to Market Cap |
0.0%
nonCashChargeToMKTCAP = Non-Cash Charges / Market Capitalization
|
| Ave Max Earning Power (5Y) | $2,315.03 |
| Ave Max Earning Power (5Q Annualized) | $834.11 |
| Ave Max Earning Power Delta (5Q Ann - 5Y) | $-1,480.92 |
| Net Cash / Share | $0 |
| Dividend indicators | Value | Date |
|---|---|---|
| Pays Dividend | No | 12-19-2025 |
| Dividend Type | common | 12-15-2025 |
| Dividend Payout / Share | $37.65 | 12-15-2025 |
| Last Dividend Date | 7-24-25 | |
| Income indicators | Value | Date |
|---|---|---|
| EBITDA Positive | Yes | 12-19-2025 |
| Net Income Positive | Yes | 12-19-2025 |
| Avg CA Burn (Annual %) | 13.84% | 12-19-2025 |
| Avg CA Burn (Quarterly %) | -2.90% | 12-19-2025 |
| Date | Shares Outstanding | Delta |
|---|---|---|
| 2025-11-04 | 34,770,906 | -96,750 |
| 2025-10-14 | 34,867,656 | -539,100 |
| 2025-09-17 | 35,406,756 | -44 |
ChipMOS TECHNOLOGIES INC. engages in the research and development, manufacture, and sale of integrated circuits, and related assembly and testing services in Taiwan, Japan, the People's Republic of China, Singapore, and internationally. The company operates through five segments: Testing, Assembly, Display Panel Driver Semiconductor Assembly and Testing (LCDD), Bumping, and Others. It offers a range of back-end testing services for high density memory, mixed-signal, and display driver semiconductors; and packaging solutions, such as small outline package, thin small outline package, quad flat package, and substrate-based packages. The company also provides testing solutions for the entire spectrum of integrated circuits, including simple digital logic, complex ASIC, high speed digital, memory, and mixed signal and display driver IC (DDIC) devices. In addition, it offers bumping services, including gold bumping, metal composite bumping, ball drop, copper re-distribution layer, and copper pillar technology. Further, the company provides wafer-level chip scale packaging technology for IC chips in the form of wafer; and turnkey solutions, including wafer bumping/RDL, wafer sort, assembly, final test, and drop shipment. Its semiconductors are used in personal computers, communications equipment, office automation, and consumer electronics. The company was incorporated in 1997 and is headquartered in Hsinchu City, Taiwan.