ChipMOS TECHNOLOGIES INC.

IMOSTWD - Financial Snapshot

Metrics for IMOSTWD

Financials reported in TWD
Price $35.2
Shares Outstanding 34.77M
All-Time Low $0.79
52-Week Low $12.78

Balance Statement Metrics

Net Cash / Share $0
cashValuePerShare = (Cash + Short Term Investments - Total Liabilities) / Shares Outstanding
⇒ cashValuePerShare = ((13,089,484,000 - 19,574,400,000) / 34,770,906) = -186.5041
Net Current Assets / Share $100.45
netCurrentAssetsPerShare = (Current Assets - Total Liabilities) / Shares Outstanding
⇒ netCurrentAssetsPerShare = ((23,067,200,000 - 19,574,400,000) / 34,770,906) = 100.4518
Net Tangible Assets / Share $672.15
netTangibleAssetsPerShare = (Total Assets - Intangibles - Total Liabilities) / Shares Outstanding
Shares Outstanding Ave Change (Annual) 0.0%
Shares Δ YoY 0.0%

Income Metrics

Max Earning Power / Share $95.73
maxEarningPowerPerShare = (EBITDA / EP_MULTIPLIER) / Shares Outstanding
⇒ maxEarningPowerPerShare = ((349,500,000 / 0.105) / 34,770,906) = 95.7286
Adjusted Earning Power $96.47
adjustedEarningPower = (Net Income / EP_MULTIPLIER) / Shares Outstanding
⇒ adjustedEarningPower = ((352,200,000 / 0.105) / 34,770,906) = 96.4682
Non-Cash Charges to Market Cap 0.0%
nonCashChargeToMKTCAP = Non-Cash Charges / Market Capitalization
Data as of: Price 02-03-26 16:00 ET, Balance Sheet 2025-09-30, Income Statement 2025-09-30, Cash Flow 2025-09-30

Indicators

Dividend indicators Value Date
Pays Dividend No 2-1-2026
Last Dividend Date 7-24-25
Income indicators Value Date
EBITDA Positive Yes 2-1-2026
Net Income Positive Yes 2-1-2026
Avg CA Burn (Annual %) 19.15% 2-1-2026
Avg CA Burn (Quarterly %) -2.76% 2-1-2026

Shares Outstanding Changes

Date Shares Outstanding Delta
2025-11-04 34,770,906 -96,750
2025-10-14 34,867,656 -539,100
2025-09-17 35,406,756 -44

Short Interest Changes

Latest short interest: 89,881 shares (0.29% of float) | Days to cover: 3.86

Date Short Interest Delta Δ %
2026-02-03 89,881 shares +0 +0.00%
2026-02-02 89,881 shares +0 +0.00%
2026-01-30 89,881 shares None

Interesting Volume Days

Volume/ratio use shares outstanding as of the event date (frozen).

Date Volume Shares Outstanding Volume / Shares Price
No interesting volume events

ChipMOS TECHNOLOGIES INC. engages in the research and development, manufacture, and sale of integrated circuits, and related assembly and testing services in Taiwan, Japan, the People's Republic of China, Singapore, and internationally. The company operates through five segments: Testing, Assembly, Display Panel Driver Semiconductor Assembly and Testing (LCDD), Bumping, and Others. It offers a range of back-end testing services for high density memory, mixed-signal, and display driver semiconductors; and packaging solutions, such as small outline package, thin small outline package, quad flat package, and substrate-based packages. The company also provides testing solutions for the entire spectrum of integrated circuits, including simple digital logic, complex ASIC, high speed digital, memory, and mixed signal and display driver IC (DDIC) devices. In addition, it offers bumping services, including gold bumping, metal composite bumping, ball drop, copper re-distribution layer, and copper pillar technology. Further, the company provides wafer-level chip scale packaging technology for IC chips in the form of wafer; and turnkey solutions, including wafer bumping/RDL, wafer sort, assembly, final test, and drop shipment. Its semiconductors are used in personal computers, communications equipment, office automation, and consumer electronics. The company was incorporated in 1997 and is headquartered in Hsinchu City, Taiwan.